Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189574 | Microelectronic package having electromagnetic interference shielding | Li-Sheng Weng, James C. Matayabas, Jr., Min Keen Tang | 2021-11-30 |
| 11177680 | Field shaper for a wireless power transmitter | Jaejin Lee, Hao-Han Hsu | 2021-11-16 |
| 10950555 | Ultra-low profile package shielding technique using magnetic and conductive layers for integrated switching voltage regulator | Kaladhar Radhakrishnan, Jaejin Lee, Hao-Han Hsu, Dong-Ho Han | 2021-03-16 |
| 10910314 | Conductive coating for a microelectronics package | Li-Sheng Weng, Emile Davies-Venn, Kemal Aygun, Mitul Modi | 2021-02-02 |