Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11211866 | Reconfigurable inductor | William J. Lambert, Beomseok Choi, Krishna Bharath, Michael J. Hill | 2021-12-28 | $27,770,000 |
| 11081434 | Package substrates with magnetic build-up layers | Zhiguo Qian, Kemal Aygun | 2021-08-03 | $25,424,000 |
| 10950555 | Ultra-low profile package shielding technique using magnetic and conductive layers for integrated switching voltage regulator | Jaejin Lee, Hao-Han Hsu, Chung-Hao Chen, Dong-Ho Han | 2021-03-16 | $38,556,000 |