Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11212932 | Pin count socket having reduced pin count and pattern transformation | Srikant Nekkanty, Zhichao Zhang | 2021-12-28 |
| 11095045 | Slow wave structure for millimeter wave antennas | Zhichao Zhang, Jiwei Sun | 2021-08-17 |
| 11094633 | Bridge die design for high bandwidth memory interface | Zhiguo Qian, Dae-Woo Kim, Jackie C. Preciado | 2021-08-17 |
| 11089689 | Fine feature formation techniques for printed circuit boards | Eric J. Li, Kai Xiao, Gong Ouyang, Zhichao Zhang | 2021-08-10 |
| 11081434 | Package substrates with magnetic build-up layers | Zhiguo Qian, Kaladhar Radhakrishnan | 2021-08-03 |
| 10992342 | Simplified multimode signaling techniques | Yidnekachew S. Mekonnen, Henning Braunisch | 2021-04-27 |
| 10950550 | Semiconductor package with through bridge die connections | Zhiguo Qian, Jianyong Xie | 2021-03-16 |
| 10910314 | Conductive coating for a microelectronics package | Li-Sheng Weng, Chung-Hao Chen, Emile Davies-Venn, Mitul Modi | 2021-02-02 |
| 10892225 | Die interconnect structures and methods | Zhiguo Qian | 2021-01-12 |
| 10886171 | Rlink-on-die interconnect features to enable signaling | Yu Zhang | 2021-01-05 |