Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145583 | Method to achieve variable dielectric thickness in packages for better electrical performance | Digvijay A. Raorane | 2021-10-12 |
| 10992342 | Simplified multimode signaling techniques | Kemal Aygun, Henning Braunisch | 2021-04-27 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov +4 more | 2021-04-06 |