Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195806 | High frequency waveguide structure | Vijay K. Nair | 2021-12-07 |
| 11189573 | Semiconductor package with electromagnetic interference shielding using metal layers and vias | Vijay K. Nair | 2021-11-30 |
| 11145583 | Method to achieve variable dielectric thickness in packages for better electrical performance | Yidnekachew S. Mekonnen | 2021-10-12 |
| 11128029 | Die with embedded communication cavity | Vijay K. Nair | 2021-09-21 |
| 11049798 | Embedded bridge with through-silicon Vias | Aditya S. Vaidya, Ravindranath V. Mahajan, Paul R. Start | 2021-06-29 |
| 11011448 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Ravindranath V. Mahajan | 2021-05-18 |