{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method to achieve variable dielectric thickness in packages for better electrical performance", "item": "https://www.patentleaderboard.com/patent/11145583"}]}
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Home › Method to achieve variable dielectric thickness in packages for better electrical performance

Method to achieve variable dielectric thickness in packages for better electrical performance

US Patent 11145583 · Granted Oct 12, 2021

Estimated economic value: $32,982,000 ⓘ

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