| 11206008 |
Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies |
Georgios Dogiamis, Telesphor Kamgaing, Feras Eid, Johanna M. Swan |
2021-12-21 |
| 11195806 |
High frequency waveguide structure |
Digvijay A. Raorane |
2021-12-07 |
| 11189573 |
Semiconductor package with electromagnetic interference shielding using metal layers and vias |
Digvijay A. Raorane |
2021-11-30 |
| 11128029 |
Die with embedded communication cavity |
Digvijay A. Raorane |
2021-09-21 |
| 11037892 |
Substrate dielectric waveguides in semiconductor packages |
Sasha N. Oster, Johanna M. Swan, Telesphor Kamgaing, Georgios Dogiamis, Adel A. Elsherbini |
2021-06-15 |
| 10903818 |
Piezoelectric package-integrated film bulk acoustic resonator devices |
Feras Eid, Adel A. Elsherbini, Telesphor Kamgaing, Georgios Dogiamis, Valluri Rao +1 more |
2021-01-26 |
| 10897238 |
Piezoelectric package-integrated contour mode filter devices |
Feras Eid, Georgios Dogiamis, Valluri Rao, Adel A. Elsherbini, Johanna M. Swan +1 more |
2021-01-19 |
| 10887439 |
Microelectronic devices designed with integrated antennas on a substrate |
Telesphor Kamgaing, Georgios Dogiamis |
2021-01-05 |