| 11211345 |
In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same |
Aleksandar Aleksov, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Eyal Fayneh, Ofir Degani +2 more |
2021-12-28 |
$27,770,000 |
| 11206008 |
Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies |
Georgios Dogiamis, Feras Eid, Vijay K. Nair, Johanna M. Swan |
2021-12-21 |
$33,282,000 |
| 11165129 |
Dispersion reduced dielectric waveguide comprising dielectric materials having respective dispersion responses |
Georgios Dogiamis, Sasha N. Oster |
2021-11-02 |
$26,002,000 |
| 11158917 |
Dual-substrate waveguide filter |
Aleksandar Aleksov, Georgios Dogiamis, Feras Eid, Johanna M. Swan |
2021-10-26 |
$21,268,000 |
| 11140723 |
Patch on interposer package with wireless communication interface |
— |
2021-10-05 |
$23,463,000 |
| 11108433 |
Single side band transmission over a waveguide |
Henning Braunisch, Georgios Dogiamis, Jeff C. Morriss, Hyung-Jin Lee, Richard J. Dischler +2 more |
2021-08-31 |
$22,590,000 |
| 11109428 |
Blade computing system with wireless communication between blades within a blade enclosure |
Rahul Khanna |
2021-08-31 |
$22,590,000 |
| 11107781 |
RFIC having coaxial interconnect and molded layer |
Srinivas V. Pietambaram, Rahul N. Manepalli, Kristof Darmawikarta, Robert Alan May, Aleksandar Aleksov |
2021-08-31 |
$22,590,000 |
| 11095012 |
Methods for conductively coating millimeter waveguides |
Aleksandar Aleksov, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff +3 more |
2021-08-17 |
$29,127,000 |
| 11062947 |
Inorganic dies with organic interconnect layers and related structures |
Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Johanna M. Swan |
2021-07-13 |
$34,958,000 |
| 11056765 |
Microelectronic devices designed with foldable flexible substrates for high frequency communication modules |
Georgios Dogiamis, Sasha N. Oster |
2021-07-06 |
$31,309,000 |
| 11050155 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems |
Feras Eid, Sasha N. Oster, Georgios Dogiamis, Aleksandar Aleksov |
2021-06-29 |
$34,663,000 |
| 11037892 |
Substrate dielectric waveguides in semiconductor packages |
Vijay K. Nair, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Adel A. Elsherbini |
2021-06-15 |
$33,380,000 |
| 11031666 |
Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric |
Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Shawna M. Liff, Aleksandar Aleksov +3 more |
2021-06-08 |
$26,946,000 |
| 11024933 |
Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer |
Brandon M. Rawlings, Shawna M. Liff, Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini +3 more |
2021-06-01 |
$35,542,000 |
| 11011470 |
Microelectronic package with mold-integrated components |
Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Johanna M. Swan |
2021-05-18 |
$44,170,000 |
| 10998879 |
Monolithic die with acoustic wave resonators and active circuitry |
Georgios Dogiamis, Feras Eid, Aleksandar Aleksov, Johanna M. Swan |
2021-05-04 |
$37,420,000 |
| 10992021 |
Cross talk and interference reduction for high frequency wireless interconnects |
Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis |
2021-04-27 |
$44,593,000 |
| 10992017 |
Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom |
Georgios Dogiamis, Aleksandar Aleksov, Gilbert Dewey, Hyung-Jin Lee |
2021-04-27 |
$44,593,000 |
| 10992016 |
Multiplexer and combiner structures embedded in a mmwave connector interface |
Sasha N. Oster, Georgios Dogiamis, Johanna M. Swan |
2021-04-27 |
$44,593,000 |
| 10964992 |
Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide |
Georgios Dogiamis, Adel A. Elsherbini, Henning Braunisch, Gilbert Dewey, Hyung-Jin Lee +1 more |
2021-03-30 |
$32,599,000 |
| 10951248 |
Radio frequency (RF) module with shared inductor |
Feras Eid, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2021-03-16 |
$38,556,000 |
| 10950919 |
System comprising first and second servers interconnected by a plurality of joined waveguide sections |
Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Brandon M. Rawlings, Aleksandar Aleksov +3 more |
2021-03-16 |
$38,556,000 |
| 10921524 |
Crimped mm-wave waveguide tap connector |
Adel A. Elsherbini, Georgios Dogiamis, Sasha N. Oster, Erich N. Ewy, Johanna M. Swan |
2021-02-16 |
$35,223,000 |
| 10910305 |
Microelectronic devices designed with capacitive and enhanced inductive bumps |
Georgios Dogiamis, Sasha N. Oster |
2021-02-02 |
$28,243,000 |
