Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107781 | RFIC having coaxial interconnect and molded layer | Srinivas V. Pietambaram, Rahul N. Manepalli, Kristof Darmawikarta, Aleksandar Aleksov, Telesphor Kamgaing | 2021-08-31 |
| 11107780 | Pseudo-stripline using double solder-resist structure | Lilia May, Amruthavalli Pallavi Alur, Robert L. Sankman | 2021-08-31 |
| 11101222 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2021-08-24 |
| 11088103 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Leonel Arana +1 more | 2021-08-10 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Lauren A. Link, Amruthavalli Pallavi Alur, Kristof Darmawikarta, Siddharth K. Alur +3 more | 2021-07-27 |
| 11069620 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Kristof Darmawikarta, Sri Ranga Sai Boyapati | 2021-07-20 |
| 11043457 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Islam A. Salama, Robert L. Sankman | 2021-06-22 |
| 11037802 | Package substrate having copper alloy sputter seed layer and high density interconnects | Kristof Darmawikarta, Sri Ranga Sai Boyapati, Sandeep Gaan, Srinivas V. Pietambaram | 2021-06-15 |
| 10978399 | Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate | Kristof Darmawikarta, Sri Ranga Sai Boyapati, Wei-Lun Kane Jen, Javier Soto Gonzalez | 2021-04-13 |
| 10916486 | Semiconductor device including silane based adhesion promoter and method of making | Andrew J. Brown, Chi-Mon Chen, Amanda E. Schuckman, Wei-Lun Kane Jen | 2021-02-09 |