Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158558 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Vipul V. Mehta, Ashish Dhall +4 more | 2021-10-26 |
| 10978399 | Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Javier Soto Gonzalez | 2021-04-13 |
| 10980129 | Asymmetric electronic substrate and method of manufacture | Sri Chaitra Jyotsna Chavali, Amruthavalli Pallavi Alur, Sriram Srinivasan | 2021-04-13 |
| 10916486 | Semiconductor device including silane based adhesion promoter and method of making | Andrew J. Brown, Chi-Mon Chen, Robert Alan May, Amanda E. Schuckman | 2021-02-09 |