Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11195727 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman | 2021-12-07 | $28,128,000 |
| 11196165 | Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications | Sri Chaitra Jyotsna Chavali, Sheng Li | 2021-12-07 | $28,128,000 |
| 11158558 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2021-10-26 | $21,268,000 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta +3 more | 2021-07-27 | $27,337,000 |
| 10903137 | Electrical interconnections with improved compliance due to stress relaxation and method of making | Sri Chaitra Jyotsna Chavali | 2021-01-26 | $50,999,000 |