Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11195727 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May | 2021-12-07 | $28,128,000 |
| 11133257 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2021-09-28 | $36,743,000 |
| 10916486 | Semiconductor device including silane based adhesion promoter and method of making | Andrew J. Brown, Chi-Mon Chen, Robert Alan May, Wei-Lun Kane Jen | 2021-02-09 | $44,388,000 |