Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133257 | Bridge interconnection with layered interconnect structures | Qinglei Zhang, Amanda E. Schuckman, Rui Zhang | 2021-09-28 |
| 10957667 | Indium solder metallurgy to control electro-migration | Kyu Oh Lee, Yi Li | 2021-03-23 |