Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166379 | Integrated circuit package substrate | — | 2021-11-02 |
| 11133257 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2021-09-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166379 | Integrated circuit package substrate | — | 2021-11-02 |
| 11133257 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2021-09-28 |