Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11158558 | Package with underfill containment barrier | Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2021-10-26 | $21,268,000 |
| 11139264 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Rahul Jain, Ji-Yong Park | 2021-10-05 | $23,463,000 |
| 11031360 | Techniques for an inductor at a second level interface | Cheng Xu, Yikang Deng, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2021-06-08 | $26,946,000 |
| 10971492 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Rahul Jain, Seo Young Kim, Ji-Yong Park, Sai Vadlamani +1 more | 2021-04-06 | $36,336,000 |
| 10957667 | Indium solder metallurgy to control electro-migration | Yi Li, Yueli Liu | 2021-03-23 | $29,278,000 |