Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158558 | Package with underfill containment barrier | Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2021-10-26 |
| 11139264 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Rahul Jain, Ji-Yong Park | 2021-10-05 |
| 11031360 | Techniques for an inductor at a second level interface | Cheng Xu, Yikang Deng, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2021-06-08 |
| 10971492 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Rahul Jain, Seo Young Kim, Ji-Yong Park, Sai Vadlamani +1 more | 2021-04-06 |
| 10957667 | Indium solder metallurgy to control electro-migration | Yi Li, Yueli Liu | 2021-03-23 |