Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205626 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani | 2021-12-21 |
| 11158558 | Package with underfill containment barrier | Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2021-10-26 |
| 11139264 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Ji-Yong Park, Kyu Oh Lee | 2021-10-05 |
| 10971492 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park, Sai Vadlamani +1 more | 2021-04-06 |
| 10923443 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Praneeth Akkinepally, Jeremy Ecton | 2021-02-16 |