Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11205626 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Lauren A. Link, Sai Vadlamani | 2021-12-21 | $33,282,000 |
| 11189409 | Electronic substrates having embedded dielectric magnetic material to form inductors | Andrew J. Brown, Lauren A. Link, Sai Vadlamani | 2021-11-30 | $30,212,000 |