Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205626 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Sai Vadlamani | 2021-12-21 |
| 11189409 | Electronic substrates having embedded dielectric magnetic material to form inductors | Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani | 2021-11-30 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta, Siddharth K. Alur +3 more | 2021-07-27 |