Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075130 | Package substrate having polymer-derived ceramic core | Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta, Siddharth K. Alur +3 more | 2021-07-27 |