Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211345 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Sri Ranga Sai Boyapati, Eyal Fayneh, Ofir Degani +2 more | 2021-12-28 |
| 11164818 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2021-11-02 |
| 11107781 | RFIC having coaxial interconnect and molded layer | Srinivas V. Pietambaram, Rahul N. Manepalli, Robert Alan May, Aleksandar Aleksov, Telesphor Kamgaing | 2021-08-31 |
| 11101222 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Javier Soto Gonzalez, Kwangmo Chris Lim | 2021-08-24 |
| 11081768 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Aleksandar Aleksov, Yonggang Li, Dilan Seneviratne | 2021-08-03 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Siddharth K. Alur +3 more | 2021-07-27 |
| 11069620 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Sri Ranga Sai Boyapati | 2021-07-20 |
| 11037802 | Package substrate having copper alloy sputter seed layer and high density interconnects | Robert Alan May, Sri Ranga Sai Boyapati, Sandeep Gaan, Srinivas V. Pietambaram | 2021-06-15 |
| 10978399 | Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate | Robert Alan May, Sri Ranga Sai Boyapati, Wei-Lun Kane Jen, Javier Soto Gonzalez | 2021-04-13 |
| 10937594 | Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates | Thomas L. Sounart, Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Johanna M. Swan | 2021-03-02 |