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Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers |
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Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same |
Adel A. Elsherbini, Henning Braunisch, Shawna M. Liff |
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Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate |
Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Wei-Lun Kane Jen |
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| 10971416 |
Package power delivery using plane and shaped vias |
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| 10971453 |
Semiconductor packaging with high density interconnects |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath +1 more |
2021-04-06 |