Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101222 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Kwangmo Chris Lim | 2021-08-24 |
| 11004824 | Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same | Adel A. Elsherbini, Henning Braunisch, Shawna M. Liff | 2021-05-11 |
| 10978399 | Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Wei-Lun Kane Jen | 2021-04-13 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov +4 more | 2021-04-06 |
| 10971453 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Krishna Bharath +1 more | 2021-04-06 |