Issued Patents 2021
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205630 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Mauro Kobrinksy, Van H. Le +1 more | 2021-12-21 |
| 11189585 | Selective recess of interconnects for probing hybrid bond devices | Brennen Mueller, Adel A. Elsherbini, Mauro J. Kobrinsky, Johanna M. Swan, Pooya Tadayon | 2021-11-30 |
| 11183477 | Mixed hybrid bonding structures and methods of forming the same | Adel A. Elsherbini, Johanna M. Swan, Nagatoshi Tsunoda, Jimin Yao | 2021-11-23 |
| 11133263 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Johanna M. Swan | 2021-09-28 |
| 11127706 | Electronic package with stud bump electrical connections | Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu +1 more | 2021-09-21 |
| 11112841 | 5G mmWave cooling through PCB | Divya Mani, William J. Lambert, Sergio Antonio Chan Arguedas, Robert L. Sankman | 2021-09-07 |
| 11101205 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Brandon M. Rawlings, Veronica Strong | 2021-08-24 |
| 11095012 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more | 2021-08-17 |
| 11094672 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Adel A. Elsherbini, Johanna M. Swan, Patrick Morrow, Gerald Pasdast, Van H. Le | 2021-08-17 |
| 11075166 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Amram Eitan, Mark Saltas | 2021-07-27 |
| 11049791 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Adel A. Elsherbini, Johanna M. Swan, Jimin Yao, Veronica Strong | 2021-06-29 |
| 11031666 | Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric | Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Aleksandar Aleksov +3 more | 2021-06-08 |
| 11024933 | Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer | Brandon M. Rawlings, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more | 2021-06-01 |
| 11016288 | Adaptable displays using piezoelectric actuators | Sasha N. Oster, Feras Eid, Johanna M. Swan, Thomas L. Sounart, Aleksandar Aleksov +2 more | 2021-05-25 |
| 11004824 | Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same | Adel A. Elsherbini, Henning Braunisch, Javier Soto Gonzalez | 2021-05-11 |
| 10998272 | Organic interposers for integrated circuit packages | Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Veronica Strong, Johanna M. Swan | 2021-05-04 |
| 10998302 | Packaged device with a chiplet comprising memory resources | Adel A. Elsherbini, Van H. Le, Johanna M. Swan, Patrick Morrow, Gerald Pasdast +1 more | 2021-05-04 |
| 10969576 | Piezo actuators for optical beam steering applications | Aleksandar Aleksov, Feras Eid, Sasha N. Oster, Johanna M. Swan, Thomas L. Sounart +2 more | 2021-04-06 |
| 10971453 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more | 2021-04-06 |
| 10969574 | Process for creating piezo-electric mirrors in package | Sasha N. Oster, Feras Eid, Johanna M. Swan, Aleksandar Aleksov, Thomas L. Sounart +2 more | 2021-04-06 |
| 10950919 | System comprising first and second servers interconnected by a plurality of joined waveguide sections | Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Brandon M. Rawlings +3 more | 2021-03-16 |
| 10943851 | Reconstituted wafer assembly | Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2021-03-09 |
| 10923415 | Semiconductor package having integrated stiffener region | Eng Huat Goh, Jiun Hann Sir, Min Suet Lim, Feras Eid | 2021-02-16 |
| 10921349 | Piezoelectric package-integrated current sensing devices | Georgios Dogiamis, Adel A. Elsherbini, Johanna M. Swan, Jelena Culic-Viskota, Thomas L. Sounart +2 more | 2021-02-16 |