| 11205630 |
Vias in composite IC chip structures |
Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Mauro Kobrinksy, Van H. Le +1 more |
2021-12-21 |
$33,282,000 |
| 11189585 |
Selective recess of interconnects for probing hybrid bond devices |
Brennen Mueller, Adel A. Elsherbini, Mauro J. Kobrinsky, Johanna M. Swan, Pooya Tadayon |
2021-11-30 |
$30,212,000 |
| 11183477 |
Mixed hybrid bonding structures and methods of forming the same |
Adel A. Elsherbini, Johanna M. Swan, Nagatoshi Tsunoda, Jimin Yao |
2021-11-23 |
$33,627,000 |
| 11133263 |
High-density interconnects for integrated circuit packages |
Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Johanna M. Swan |
2021-09-28 |
$36,743,000 |
| 11127706 |
Electronic package with stud bump electrical connections |
Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu +1 more |
2021-09-21 |
$30,488,000 |
| 11112841 |
5G mmWave cooling through PCB |
Divya Mani, William J. Lambert, Sergio Antonio Chan Arguedas, Robert L. Sankman |
2021-09-07 |
$31,495,000 |
| 11101205 |
Interconnection structure fabrication using grayscale lithography |
Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Brandon M. Rawlings, Veronica Strong |
2021-08-24 |
$32,164,000 |
| 11095012 |
Methods for conductively coating millimeter waveguides |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more |
2021-08-17 |
$29,127,000 |
| 11094672 |
Composite IC chips including a chiplet embedded within metallization layers of a host IC chip |
Adel A. Elsherbini, Johanna M. Swan, Patrick Morrow, Gerald Pasdast, Van H. Le |
2021-08-17 |
$29,127,000 |
| 11075166 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate |
Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Amram Eitan, Mark Saltas |
2021-07-27 |
$27,337,000 |
| 11049791 |
Heat spreading layer integrated within a composite IC die structure and methods of forming the same |
Adel A. Elsherbini, Johanna M. Swan, Jimin Yao, Veronica Strong |
2021-06-29 |
$34,663,000 |
| 11031666 |
Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric |
Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Aleksandar Aleksov +3 more |
2021-06-08 |
$26,946,000 |
| 11024933 |
Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer |
Brandon M. Rawlings, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more |
2021-06-01 |
$35,542,000 |
| 11016288 |
Adaptable displays using piezoelectric actuators |
Sasha N. Oster, Feras Eid, Johanna M. Swan, Thomas L. Sounart, Aleksandar Aleksov +2 more |
2021-05-25 |
$32,857,000 |
| 11004824 |
Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same |
Adel A. Elsherbini, Henning Braunisch, Javier Soto Gonzalez |
2021-05-11 |
$38,242,000 |
| 10998272 |
Organic interposers for integrated circuit packages |
Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Veronica Strong, Johanna M. Swan |
2021-05-04 |
$37,420,000 |
| 10998302 |
Packaged device with a chiplet comprising memory resources |
Adel A. Elsherbini, Van H. Le, Johanna M. Swan, Patrick Morrow, Gerald Pasdast +1 more |
2021-05-04 |
$37,420,000 |
| 10969576 |
Piezo actuators for optical beam steering applications |
Aleksandar Aleksov, Feras Eid, Sasha N. Oster, Johanna M. Swan, Thomas L. Sounart +2 more |
2021-04-06 |
$36,336,000 |
| 10971453 |
Semiconductor packaging with high density interconnects |
Adel A. Elsherbini, Johanna M. Swan, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more |
2021-04-06 |
$36,336,000 |
| 10969574 |
Process for creating piezo-electric mirrors in package |
Sasha N. Oster, Feras Eid, Johanna M. Swan, Aleksandar Aleksov, Thomas L. Sounart +2 more |
2021-04-06 |
$36,336,000 |
| 10950919 |
System comprising first and second servers interconnected by a plurality of joined waveguide sections |
Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Brandon M. Rawlings +3 more |
2021-03-16 |
$38,556,000 |
| 10943851 |
Reconstituted wafer assembly |
Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan |
2021-03-09 |
$45,039,000 |
| 10923415 |
Semiconductor package having integrated stiffener region |
Eng Huat Goh, Jiun Hann Sir, Min Suet Lim, Feras Eid |
2021-02-16 |
$35,223,000 |
| 10921349 |
Piezoelectric package-integrated current sensing devices |
Georgios Dogiamis, Adel A. Elsherbini, Johanna M. Swan, Jelena Culic-Viskota, Thomas L. Sounart +2 more |
2021-02-16 |
$35,223,000 |
