Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114388 | Warpage control for microelectronics packages | Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande | 2021-09-07 |
| 11089689 | Fine feature formation techniques for printed circuit boards | Kemal Aygun, Kai Xiao, Gong Ouyang, Zhichao Zhang | 2021-08-10 |
| 11075166 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas | 2021-07-27 |
| 10910317 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Sanka Ganesan, Debendra Mallik, Robert L. Sankman | 2021-02-02 |