Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127706 | Electronic package with stud bump electrical connections | Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu +1 more | 2021-09-21 |
| 11114388 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Huiyang Fei, Sairam Agraharam, Nitin A. Deshpande | 2021-09-07 |
| 11056466 | Package on package thermal transfer systems and methods | Christopher L. Rumer, Nitin A. Deshpande, Robert M. Nickerson | 2021-07-06 |