Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11127706 | Electronic package with stud bump electrical connections | Zhaozhi Li, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more | 2021-09-21 | $30,488,000 |
| 11107757 | Integrated circuit structures in package substrates | William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2021-08-31 | $22,590,000 |
| 10910317 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Eric J. Li, Debendra Mallik, Robert L. Sankman | 2021-02-02 | $28,243,000 |
| 10903166 | Integrated circuit packages | Thorsten Meyer, Gerald Ofner | 2021-01-26 |