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Semiconductor panels, semiconductor packages, and methods for manufacturing thereof |
Andreas Grassmann |
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| 11081455 |
Semiconductor device with bond pad extensions formed on molded appendage |
Chan Lam Cha, Wei Han Koo, Klaus Schiess, Guan Choon Matthew Nelson Tee |
2021-08-03 |
| 10964628 |
Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture |
Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz +1 more |
2021-03-30 |
| 10916484 |
Electronic device including redistribution layer pad having a void |
Robert Fehler, Francesca Arcioni, Christian Geissler, Walter Hartner, Gerhard Haubner +2 more |
2021-02-09 |
| 10903166 |
Integrated circuit packages |
Sanka Ganesan, Gerald Ofner |
2021-01-26 |
| 10886186 |
Semiconductor package system |
Thorsten Scharf, Ralf Otremba, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber +2 more |
2021-01-05 |
