Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081455 | Semiconductor device with bond pad extensions formed on molded appendage | Wei Han Koo, Thorsten Meyer, Klaus Schiess, Guan Choon Matthew Nelson Tee | 2021-08-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081455 | Semiconductor device with bond pad extensions formed on molded appendage | Wei Han Koo, Thorsten Meyer, Klaus Schiess, Guan Choon Matthew Nelson Tee | 2021-08-03 |