Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081455 | Semiconductor device with bond pad extensions formed on molded appendage | Chan Lam Cha, Wei Han Koo, Thorsten Meyer, Guan Choon Matthew Nelson Tee | 2021-08-03 |
| 10903133 | Method of producing an SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner +2 more | 2021-01-26 |