Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Josef Maerz, Thorsten Meyer +1 more | 2021-03-30 |
| 10886186 | Semiconductor package system | Thorsten Scharf, Ralf Otremba, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber +2 more | 2021-01-05 |