Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Michael Juerss, Thorsten Meyer +1 more | 2021-03-30 |
| 10886199 | Molded semiconductor package with double-sided cooling | Chau Fatt Chiang, Swee Kah Lee, Thomas Stoek, Chee Voon Tan | 2021-01-05 |