Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11174152 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng | 2021-11-16 |
| 11133281 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Stefan Macheiner, Wae Chet Yong | 2021-09-28 |
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee, Joachim Mahler +3 more | 2021-08-03 |
| 10886199 | Molded semiconductor package with double-sided cooling | Swee Kah Lee, Josef Maerz, Thomas Stoek, Chee Voon Tan | 2021-01-05 |