Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145578 | Semiconductor package with top or bottom side cooling and method for manufacturing the semiconductor package | — | 2021-10-12 |
| 11133281 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Chau Fatt Chiang, Wae Chet Yong | 2021-09-28 |
| 11101201 | Semiconductor package having leads with a negative standoff | Thomas Stoek, Dirk Ahlers | 2021-08-24 |