Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183445 | Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangement | Dirk Ahlers, Frank Daeche, Daniel Schleisser | 2021-11-23 |
| 11101201 | Semiconductor package having leads with a negative standoff | Dirk Ahlers, Stefan Macheiner | 2021-08-24 |
| 10971436 | Multi-branch terminal for integrated circuit (IC) package | Chii Shang Hong, Chiew Li Tai, Edmund Sales Cabatbat | 2021-04-06 |
| 10886199 | Molded semiconductor package with double-sided cooling | Chau Fatt Chiang, Swee Kah Lee, Josef Maerz, Chee Voon Tan | 2021-01-05 |