Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075185 | Semiconductor package with multi-level conductive clip for top side cooling | Chii Shang Hong, Ivan Nikitin, Wei Han Koo | 2021-07-27 |
| 10978380 | Semiconductor package with multi-level conductive clip for top side cooling | Chii Shang Hong, Wei Han Koo | 2021-04-13 |
| 10971436 | Multi-branch terminal for integrated circuit (IC) package | Thomas Stoek, Chii Shang Hong, Edmund Sales Cabatbat | 2021-04-06 |