Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075185 | Semiconductor package with multi-level conductive clip for top side cooling | Chii Shang Hong, Wei Han Koo, Chiew Li Tai | 2021-07-27 |
IN
Ivan Nikitin
Overall (2021): #422,690 of 548,734Top 80%
1
Patents 2021