Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133281 | Chip to chip interconnect in encapsulant of molded semiconductor package | Chau Fatt Chiang, Stefan Macheiner, Wae Chet Yong | 2021-09-28 |
KS
Khay Chwan Saw
Overall (2021): #373,364 of 548,734Top 70%
1
Patents 2021