Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133281 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Chau Fatt Chiang, Stefan Macheiner | 2021-09-28 |
| 10978378 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Thomas Bemmerl, Kuok Wai Chan, Christoph Liebl, Bun Kian Tay, Wee Boon Tay | 2021-04-13 |