Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183451 | Interconnect clip with angled contact surface and raised bridge | Chai Chee Lee | 2021-11-23 |
| 10978378 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Thomas Bemmerl, Kuok Wai Chan, Christoph Liebl, Bun Kian Tay, Wae Chet Yong | 2021-04-13 |