Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978378 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Thomas Bemmerl, Kuok Wai Chan, Christoph Liebl, Wee Boon Tay, Wae Chet Yong | 2021-04-13 |
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz +1 more | 2021-03-30 |