Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978378 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Thomas Bemmerl, Christoph Liebl, Bun Kian Tay, Wee Boon Tay, Wae Chet Yong | 2021-04-13 |