Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189537 | Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit | Khalil Hosseini, Edward Fuergut | 2021-11-30 |
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2021-08-03 |
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2021-04-13 |