Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11073572 | Current sensor device with a routable molded lead frame | Rainer Markus Schaller | 2021-07-27 |
| 11024565 | Direct selective adhesion promotor plating | Kim Huat Hoa, Hazrul Alang Abd Hamid, Andreas Allmeier, Dietmar Lang | 2021-06-01 |
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Joachim Mahler, Michael Bauer, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2021-04-13 |