Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Johann Gatterbauer, Frank Hille +6 more | 2021-04-13 |