Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127693 | Barrier for power metallization in semiconductor devices | Katrin Albers, Joerg Busch, Klaus Goller, Norbert Mais, Marianne Kolitsch +3 more | 2021-09-21 |
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Frank Hille +6 more | 2021-04-13 |