Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11174152 | Over-under sensor packaging with sensor spaced apart from control chip | Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng | 2021-11-16 |
| 11081417 | Manufacturing a package using plateable encapsulant | Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee, Joachim Mahler +3 more | 2021-08-03 |