Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11174152 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee | 2021-11-16 |
| 11039231 | Package with acoustic sensing device(s) and millimeter wave sensing elements | Kok Yau Chua | 2021-06-15 |