Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145563 | Semiconductor devices having cutouts in an encapsulation material and associated production methods | Walter Hartner, Claus Waechter, Maciej Wojnowski | 2021-10-12 |
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Francesca Arcioni, Walter Hartner, Gerhard Haubner, Thorsten Meyer +2 more | 2021-02-09 |
| 10899604 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Robert Gruenberger, Claus Waechter, Bernhard Winkler | 2021-01-26 |