Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195787 | Semiconductor device including an antenna | Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Huber, Dominic Maier +4 more | 2021-12-07 |
| 11145563 | Semiconductor devices having cutouts in an encapsulation material and associated production methods | Christian Geissler, Walter Hartner, Claus Waechter | 2021-10-12 |
| 10930541 | Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip package | Thomas Kilger, Francesca Arcioni | 2021-02-23 |
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Francesca Arcioni, Christian Geissler, Walter Hartner, Gerhard Haubner +2 more | 2021-02-09 |