Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11192777 | MEMS sensor package systems and methods | Rainer Leuschner, Horst Theuss | 2021-12-07 |
| 11118345 | Structure having edge reinforcement on profiled rail | Peter Gstach, Jakob Kunz, Andrin Nigg, Philipp Grosser, Daniele Casucci | 2021-09-14 |
| 10996125 | Pressure sensors and method for forming a MEMS pressure sensor | Markus Eckinger, Dirk Hammerschmidt, Florian BRANDL | 2021-05-04 |
| 10899604 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Christian Geissler, Robert Gruenberger, Claus Waechter | 2021-01-26 |