Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158558 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more | 2021-10-26 |
| 10910317 | Semiconductor package having wafer-level active die and external die mount | Eric J. Li, Sanka Ganesan, Debendra Mallik, Robert L. Sankman | 2021-02-02 |